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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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4 Layer Half Hole Bluetooth Module Fr4 Circuit Board With Exposure Gold Of Antenna

Shenzhen Xinchenger Electronic Co.,Ltd
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4 Layer Half Hole Bluetooth Module Fr4 Circuit Board With Exposure Gold Of Antenna

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Brand Name : XCEPCB

Model Number : XCEF-A

Certification : SGS,ISO9001,UL

Place of Origin : China

MOQ : 1 pcs

Price : USD0.1-100

Payment Terms : Western Union,, T/T

Supply Ability : 1000000PCS/M

Delivery Time : 3-12 WDS

Packaging Details : inner bubble pack, outer carton box

Material : Kingboard FR4

Color : blue

Technology : Hole ENIG

Product : bluetooth module

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FR4 4 Layer Half Bluetooth Module With Exposure Gold Of Antenna

Layer:4 Material:FR4
Copper THK:1OZ Board THK:0.8mm
Finish: ENIG Origin: China

Bluetooth module, is an integrated Bluetooth PCB board for short-distance wireless communication, Bluetooth data modules are divided into functions and Bluetooth voice module.

1 Description PCB Specification
2 Material FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum
3 Layer 1-20
4 Board Thickness 0.2mm- 4.0mm
5 Board Thickness Tolerance +/-10%
6 Copper thickness 17.5um-175um (0.5oz-5oz)
7 Min Trace Width 0.15mm
8 Min Space Width 0.15mm
9 Min Drilling Dia 0.2mm
10 PTH copper thickness 0.4-2mil(10-50um)
11 Tolerance of Etching ±1mil(±25um)
12 V-cut angle 25°,30°,45°,60°
13 Pearl Strength of line ≥ 6lb/in(≥ 107g/mm)
14 Impedance control and tolerance 50Ω±10%
15 Twist&Wrap ≤ 0.5%
16 Soldermask Green, Red, Blue, White, Black, Yellow
17 Surface Finish/Plating HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG
18 Certificate ROSH. ISO9001, UL Certificate
19 File Protel 99se/P-CAD/Autocad/Cam350
20 Inner packing Vacuum packing,Plastic bag
21 Outer packing Standard carton packing

4 Layer Half Hole Bluetooth Module Fr4 Circuit Board With Exposure Gold Of Antenna

4 Layer Half Hole Bluetooth Module Fr4 Circuit Board With Exposure Gold Of Antenna


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