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Brand Name : XCE
Model Number : XCEF
Certification : CE,ROHS, FCC,ISO9008
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union, L/C, MoneyGram
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Line space : 2mil
Copper THK : 5OZ
Line Width : 3mil
Immersion gold : 10 micro inch
Material : KB FR4
Hole : resin plug hole
High Precision FR4 PCB High Difficult Customized Service Printed Circuit Board
  
 Specification:  
high difficult pcb such as min line space and width 2mil
Machinable maximum thickness to diameter ratio: 10:1
 Hole position deviation: ±0.05mm/ 2mil
 Profile tolerance: ±0.15mm/ 6mil
 Min S/M bridge: 0.1mm/ 4mil
 Twist and bent: ≤1.5%
 Peel strength: 1.5N/mm
 Solder mask abrasion: >4H
 Parameter:
| Layer | 1-26(layer) | 
| Max Board size | 2layer :600mm*1200mm(24" * 47)" | 
| Multilayer :600mm*600mm(24" * 24)" | |
| Copper thick | 0.5OZ-8OZ/18um-280um | 
| Min Board Thickness | single:0.1mm—6.0mm/4mil-240mil | 
| 2 layer:0.2mm--6.0mm/8mil-240mil | |
| 4 layer: 0.4mm-6.0mm /16mil-240mil | |
| 6 layer: 0.8mm-6.0mm/32mil-240mil | |
| 8 layer: 1.0mm-6.0mm/40mil-240mil | |
| 10 layer: 1.5mm-6.0mm/60mil-240mil | |
| Min line width( sample) | 0.075mm/3mil | 
| Min space( sample) | 0.075mm/ 3mil | 
| Min hole size | 0.2mm/8mil | 
| Machinable maximum thickness to diameter ratio | 10:1 | 
| Impedance control | +/-10% | 
Quality control

 Application:
Products are applied to a wide range of High-tech industries such as: Medical instrumentation,wireless and wired telecommunication,computer application, lighting, game machine, industrial control, Power amplifier automobile and high-end consumer electronics, ect.
 
  
  
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