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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Circuit Board Electronic FR4 PCB 10 Layer With 2MM Thickness

Shenzhen Xinchenger Electronic Co.,Ltd
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Shenzhen Xinchenger Electronic Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-26055813
Contact Person:
Ms kico

Circuit Board Electronic FR4 PCB 10 Layer With 2MM Thickness

Brand Name : XCE
Model Number : XCEM
Certification : CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Material : FR4
Layer : 10
Color : Black
Min line space : 4mil
Min line width : 4mil
Copper thickness : 1OZ
Board size : 108*89MM
Panel : 1
Surface : Immersion Gold
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Circuit Board Design Electronic FR4 PCB 10 Layer With 2MM Thickness

Key Specifications/Special Features:
-Layer: 1-20
-Material: FR4 Laminate RoHS Compliance/High TG/Halogen Free/Aluminum Base
-PCB Thickness: 0.4-6.0mm
-Max Board Sice:580x1200mm
-Final Copper: 0.5-7oz
-Min.Hole Size : 0.1mm
-Min Line Width/Spacing: 3/3mil(0.075/0.075mm)
-Hole Size Tolerance (PTH): +/ -3mil (0.075mm)
-Hole Size Tolerance (NPTH): +/ -2mil (0.05mm)
-Hole Location Telerance: +/ -3mil (0.075mm)
-Min Hole Copper: 20µm
-Soldermasks: Green/Blue/Red/Black/Yellow/White
-Legend: White/Black/Yellow/Green
-Surface Treatment: OSP/HAL Lead-Free/Immersion Gold/immersion Tin/
-Immersion Silver/Flash gold/Hard gold
-Profile Finish: Routing/Punching/V-Cut
-E-Test: 100% E-Test With Flying Prob or E-Test Fixture
-Inspection Rtandard: IPC-A-600H/IPC-6012B, Class 2/3
-Outgoing Reports: Final Inspection, E-Test, Solderability Test, Microsection and so on.
-PCB Packing: Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
-Certificates: UL, SGS, RoHS, ISO14001:2004, ISO/TS16949:2009


Product Description
Product Name: Printed Circuit board(PCB)
Certificate: ISO 9001 /ISO14001 RoHS UL /TS16949
Quality standard: IPC
Number of Layer: Single-layer /double-layer / 4 layer - 36 layer
Copper Thickness: 0.5-10 oz
Laminate material: FR-4/PI/Aluminium base
Base Board Thickness: 0.13-7.0mm

Surface Finishing: HASL (lead free)/HAL / Immersion AU, Gold / Gold Finger / OSP
Min. Line Width and Spacing: 0.1mm/0.1mm
Mini. Hole Diameter: 0.1mm
Imcombustibility: 94V 0
Inner packing: Vacuum packing
Outer packing: Standard carton packing

Parameter:

Product nameFR4 PCBDouble side4 layer6 layer8 layer10-28layer
layerSingle sideDouble side4 layer6 layer8 layer10-28layer
Base MaerialFR4FR4,Alu,polymideFR4FR4FR4FR4
Copper thickness1-6OZ
Min.Hole size0.1mm
Min.Line Width0.1mm
Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker colorgreen,red,black,white,yellow
Silkscreen colorblack,white,yellow
Tolerance- Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirementsBuried and blind vias+controlled impedance +BGA

Rigid PCB Manufacturing Capabilities
Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:01
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:01

Product parameter of prototype pcb

1LayersSingle Sided,2 to 18 Layer
2Board material typeRogers,Taconic,F4B,Isola and more
3Compound material lamination4 to 6 layers
4Maximum dimension610 x 1,100mm
5Dimension tolerance±0.13mm
6Board thickness coverage0.2 to 6.00mm
7Board thickness toleranceBoard thickness≤1.0mm: +/-0.1mm
1<Board thickness≤2.0mm: +/-10%
Board thickness>2.0mm: +/-8%
8DK thickness0.076 to 6.00mm
9Minimum line width0.10mm
10Minimum line space0.10mm
11Outer layer copper thickness8.75 to 175µm
12Inner layer copper thickness17.5 to 175µm
13Drilling hole diameter (mechanical drill)0.25 to 6.00mm
14Finished hole diameter (mechanical drill)0.20 to 6.00mm
15Hole diameter tolerance (mechanical drill)0.05mm
16Hole position tolerance (mechanical drill)0.075mm
17Laser drill hole size0.10mm
18Board thickness and hole diameter ratio10:01
19Solder mask typeGreen, Yellow, Black, Purple, Blue, White and Red
20Minimum solder maskØ0.10mm
21Minimum size of solder mask separation ring0.05mm
22Solder mask oil plug hole diameter0.25 to 0.60mm
23Impedance control tolerance±10%
24Surface finishHot air level, ENIG, immersion silver, gold plating, immersion tin and gold finger
25CertificateROHS, ISO9001:2008, SGS, UL certificate
26Acceptable file formatGerber file,PROTEL series,PADS series,POWER PCB series,AutoCAD














































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fr4 circuit board

      
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