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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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6 Layers Fr4 PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power

Shenzhen Xinchenger Electronic Co.,Ltd
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Shenzhen Xinchenger Electronic Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Contact Person:Ms karen

6 Layers Fr4 PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power

Brand Name : XCE
Model Number : XCEM
Certification : CE,ROHS, FCC,ISO9008,SGS,UL
Place of Origin : China
MOQ : 1pcs
Price : negotiation
Payment Terms : T/T,Western union
Supply Ability : 1, 000, 000 PCS / week
Delivery Time : 5-10 days
Packaging Details : inner: vacuum-packed bubble bag outer: carton box
Material : FR4
Layer : 6
Color : Green
Min line space : 4mil
Min line width : 4mil
Copper thickness : 1OZ
Board size : 300*199MM
Panel : 1
Surface : Immersion Tin
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6 Layers PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power Supply

Key Specifications/Special Features:
-Layer: 1-20
-Material: FR4 Laminate RoHS Compliance/High TG/Halogen Free/Aluminum Base
-PCB Thickness: 0.4-6.0mm
-Max Board Sice:580x1200mm
-Final Copper: 0.5-7oz
-Min.Hole Size : 0.1mm
-Min Line Width/Spacing: 3/3mil(0.075/0.075mm)
-Hole Size Tolerance (PTH): +/ -3mil (0.075mm)
-Hole Size Tolerance (NPTH): +/ -2mil (0.05mm)
-Hole Location Telerance: +/ -3mil (0.075mm)
-Min Hole Copper: 20µm
-Soldermasks: Green/Blue/Red/Black/Yellow/White
-Legend: White/Black/Yellow/Green
-Surface Treatment: OSP/HAL Lead-Free/Immersion Gold/immersion Tin/
-Immersion Silver/Flash gold/Hard gold
-Profile Finish: Routing/Punching/V-Cut
-E-Test: 100% E-Test With Flying Prob or E-Test Fixture
-Inspection Rtandard: IPC-A-600H/IPC-6012B, Class 2/3
-Outgoing Reports: Final Inspection, E-Test, Solderability Test, Microsection and so on.
-PCB Packing: Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
-Certificates: UL, SGS, RoHS, ISO14001:2004, ISO/TS16949:2009


Features:
>Glass-reinforced hydrocarbon and ceramic dielectric
>Excellent high frequency performance due to low dielectric tolerance and loss
>Stable electrical properties versus frequency
>Low Z-axis expansion and excellent dimensional stability

specification:
layer: multilayer
material: fr4
Tg value: tg135-tg180
board thickness:1.6mm
copper thickness:.1.5oz
surface treatment:Hasl lead free+gold finger
About us:
With 900workers,full-process equippted(including lamination.imersion Gold),we make 1~24layers board in guaranteed quality.
Special Advantage: High frequency board-rogers,ITEQ,board thickness 0.2~7.0mm,copper thickness 1/3~8oz are available )

PCB capability and services:
1. Single-sided, double side & multi-layer PCB. Rogers&Taconic&F4B PCB with competitive price,
good quality and excellent service.
2. Rogers,Taconic,F4B,Isola,Arlon, etc.
3. HAL, HAL lead free, Immersion Gold/ Silver/Tin, OSP surface treatment.
4. Quantities range from sample to mass order<
5. 100% E-Test
SMT (Surface mounting technology), COB, DIP.
1. Material Sourcing Service
2. SMT assembly and Through hole components insertion
3. IC pre-programming / Burning on-line
4. Function testing as requested
5. Complete Unit assembly (which including plastics, metal box, Coil, cable inside etc)
6.OEM/ODM also welcomed


Parameter:

Product nameFR4 PCBDouble side4 layer6 layer8 layer10-28layer
layerSingle sideDouble side4 layer6 layer8 layer10-28layer
Base MaerialFR4FR4,Alu,polymideFR4FR4FR4FR4
Copper thickness1-6OZ
Min.Hole size0.1mm
Min.Line Width0.1mm
Surface finishing:HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
Solder masker colorgreen,red,black,white,yellow
Silkscreen colorblack,white,yellow
Tolerance- Shape tolerance: ±0.13
- Hole tolerance: PTH: ±0.076 NPTH: ±0.05
Special requirementsBuried and blind vias+controlled impedance +BGA

Rigid PCB Manufacturing Capabilities
Total Pad SizeStandardAdvanced
Capture PadDrill + 0.008Drill + 0.006
Landing PadDrill + 0.008Drill + 0.006
BC Mechanical Drill (Type III)0.0080.006
Laser Drill Size0.004-0.0100.0025
Material Thickness0.00350.0025
Stacked ViaYesYes
Type I Capabilities single & Double DeepYesYes
Type II Capabilities Buried Vias with MicroviasYesYes
Type III CapabilitiesYesYes
Copper Filled MicroviaYesYes
Smallest Copper Filled Microvia0.0040.0025
Copper Filled Microvia Aspect Ratio0.75:11:01
Smallest Laser Microvia Hole Size0.0040.0025
Laser Via Aspect Ratio (Depth:Diameter)0.75:11:01
Turn TimesSelected VolumeSelected Solder Types
Same day through four weeks turnsNo minimum order quantityLeaded
Scheduled deliveriesEngineering prototypesLead-free/RoHS compliant
Low cost first article buildsNo-clean process available
Parts ProcurementSelected StencilsSelected Ball Grid Arrays (BGA)
TurnkeyLaser cut stainless steelAs small as .5mm pitch
Kitted/ConsignedNano-coating availableAll BGA placements are x-ray inspected
Partial Turnkey
Assembly TypesSelected Component TypesSelected Other Capabilities
Surface Mount (SMT)As small as 0402 packagePitch components as small as 15 mil
Thru-holeAs small as 0201 with design reviewRepair/Rework services
Mixed Technology (SMT/Thru-hole)Mechanical Assembly
Single or double sided placementBox Build/Electromechanical Assembly
Sub-assemblies



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6 Layers Fr4 PCB with Immersion Tin/ RoHS/BGA/UL In White Soldermask For Power Images

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