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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

Shenzhen Xinchenger Electronic Co.,Ltd

Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Material : FR4

Layer : 6

Color : Green

Min line space : 4mil

Min line width : 4mil

Copper thickness : 1OZ

Board size : 66*66mm

Panel : 1

Surface : ENIG

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Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit

XCE PCB technical specification
Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

Main Export Markets:
Asia
Australasia
Central/South America
Eastern Europe
Mid East/Africa
North America
Western Europe
Specification:
Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit
Green Soldermask White Silkscreen,
FR - 4 epoxy glass fiber cloth substrate, based on epoxy resin as binder,
with electronic level glass fiber cloth as reinforcing material of substrate.
Its bonding sheet and thin copper-clad r.p. panel and inner core is an important base material
in production of multilayer printed circuit board,
This kind of product is mainly used for double-sided PCB, dosage is very large.
Epoxy glass fiber cloth substrate, the most widely used model for FR - 4,
in recent years because of the electronic product installation technology
and PCB technology development needs, appeared high Tg FR - 4 products.

Advantage Highlights

  • Specialized in 2- to 32-layer PCB
  • ISO 9001-, ISO 14001- and ISO/TS 16949-certified
  • Products are UL- and RoHS-certified
  • Partner for over 2000 small- and medium-scale customers
  • Two factory bases totaling 22,000 square meters
  • Less than 12-hours quick response to inquiries
  • Widely acclaimed and satisfying services
  • Over 66% of PCBs are exported to international markets

Parameter:

o Item Data
1 Layer: 1 to 24 layers
2 Material type: FR-4, CEM-1, CEM-3, High TG, FR4 Halogen Free, Rogers
3 Board thickness: 0.20mm to 3.4mm
4 Copper thickness: 0.5 OZ to 4 OZ
5 Copper thickness in hole: >25.0 um (>1mil)
6 Max. Board Size: (580mm×1200mm)
7 Min. Drilled Hole Size: 4mil(0.1mm)
8 Min. Line Width: 3mil (0.075mm)
9 Min. Line Spacing: 3mil (0.075mm)
10 Surface finishing: HASL / HASL lead free, HAL, Chemical tin, Chemical Gold, Immersion Silver/Gold, OSP, Gold plating
11 Solder Mask Color: Green/Yellow/Black/White/Red/Blue
12 Shape tolerance: ±0.13
13 Hole tolerance: PTH: ±0.076 NPTH: ±0.05
14 Package: Inner packing: Vacuum packing / Plastic bag,Outer packing: Standard carton packing
15 Certificate: UL,SGS,ISO 9001:2008
16 Special requirements: Buried and blind vias+controlled impedance +BGA
17 Profiling: Punching, Routing, V-CUT, Beveling


Place of Origin:

Guangdong China (Mainland)

Brand Name:

XCE

Model Number:

XCEPCB008

Base Material:

FR4

Copper Thickness:

0.3-3oz

Board Thickness:

0.3-6mm

Min. Hole Size:

0.2mm

Min. Line Width:

3mil

Min. Line Spacing:

3mil

Surface Finishing:

HASL, OSP, Immersion Gold/Au, Immersion silver, etc.

Solder mask:
Green
PCB Standard:

IPC-A-610 E Class II-III

Wrap and twist:

5%

Layer Count:

1-22

profiling punching:

Routing, V-CUT, Beveling

Max board size:

1200mm*600mm

Hole tolerance:

PTH:±0.075,NTPH:±0.05

PCB Tolerance of finished thickness:

±5%

PCB:

Customized

Product name:

pcb

Product Feature:

1. OEM&ODM are availble, different shape for your choice

2. Programmable, it can change different colors and lighting ways

3. Green and Energy saving, best for your lighting project


Why choose us

1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM, any your customized lightings we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information


Trade Terms
1. Payment: T/T in advance (Western Union is welcomed)

2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.

3. Sample can be delivered in 3days

4. Shipping freight are quoted under your requests

5. Shipping port: Shenzhen, Mainland China

6. Discounts are offered based on order quantities

7. MOQ: 1PC


Product Tags:

multi layered pcb

      

multilayer pcb fabrication

      
Quality Immersion Gold Multilayer PCB Circuit Board Micro Via Holes Battery Protection Circuit for sale

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