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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Fr4 High TG 170 Rigid PCB Board Prototype With 2U Gold Plating Surface Finish

Shenzhen Xinchenger Electronic Co.,Ltd

Fr4 High TG 170 Rigid PCB Board Prototype With 2U Gold Plating Surface Finish

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Brand Name : XCE

Model Number : XCER-1

Certification : CE,ROHS, FCC,ISO9008

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Base material : Rogers5880

Name : Rogers PCB

Board thickness : 0.2mm

Copper THK : 1OZ

Board size : 9*9cm

Surface finish : Immersion gold

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Fr4 High TG 170 Rigid PCB Board Prototype With 2U Gold Plating Surface Finish​

Specification

PCB Type:

Rogers PCB

Layer :

6 layer

Min .Line Width/Space:

3mil/3mil

Min. Via Diameter:

0.3mm

Finish Thickness:

0.2mm

Surface Finish:

ENIG

Size:

90*90MM

Material:

5880

Color:

golden

Application:

aerospace

Parameter

Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal
Electric strength >1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity >6H
Thermal stress 288℃20Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating


Description:

A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.

Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.


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