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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Multilayer High Frequency Taconic Pcb TLY Military Low DK Base

Shenzhen Xinchenger Electronic Co.,Ltd

Multilayer High Frequency Taconic Pcb TLY Military Low DK Base

Brand Name : XCE

Model Number : XCE Bh77

Certification : CE,ROHS,FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : MOQ 1 Piece

Price : Negotiation

Payment Terms : T/T, Western Union

Supply Ability : 1000000 pieces per week

Delivery Time : 5-10 working days

Packaging Details : 1)Vacuum package and carton box 2)Inner package:Vacuum package+drye 3)outer Package:Carton Package

Color : Blue

Material : PTFE Material

Layer : Multilayer

Board Size : 12*3cm

Copper Thinknes : 1 oz

Min Line Width : 4 mil

Min Line Space : 4mil

Surface Finish : Immersion Gold

Name : Taconic pcb

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Multilayer High Frequency Taconic Pcb With TLY Military Grade Very Low DK Base Material Low Cost RF Laminate

Quick Detail :
1. Type : Pcb
2. Material : PTFE
3. Layer : Multilayer
4. Products Size :12*3cm
5. Permittivity : 3.5
6. Surface finish : Immersion Gold

Features:
1. oven glass laminates are constructed with a woven matrix of fiber-glass fabric coated with PTFE that is more mechanically stable and has a more uniform dielectric constant than traditional non-woven products. The laminates are dimensionally stable, and exhibit virtually no moisture absorption during fabrication process.
2. Immersion gold surface finish make the pcb 's conductive performance enhancements.
3. Multilayer pcb design ,the precision of the pcb improves much more better .
4. Low dielectric : 2.5 dielectric conductivity much more precision .

Parameter:

Model Parameter thickness(mm) Permittivity(ER)
F4B F4B 0.38 2.2
F4B 0.55 2.23
F4B 0.225,0.3,0.5,08,1,1.2,1.5,2,2.5,3.0 2.65
F4Bk 0.8,1.5 2.65
F4B 0.8 3.5
FE=F4BM 1 2.2
Rogers RO5880 0.254 0.508 0.762 2.20 ± 0.02
RO4350 0.254 0.508,0.8,1.524 3.5
RO4003 0.508 3.38
TACONIC TLF-35 0.8 3.5
TLA-6 0.254,0.8,1,1.5, 2.65
TLX-8 0.254,0.8,1,1.6 2.55
RF-60A 0.64 6.15
TLY-5 0.254,0.508,0.8 2.2
TLC-32 0.8,1.5,3 3.2
TLA-35 0.8 3.2
ARLON AD255C06099C 1.5 2.55
MCG0300CG 0.8 3.7
AD0300C 0.8 3
AD255C03099C 0.8 2.55
AD255C04099C 1 2.55
DLC220 1 2.2


Description :

with aTg > 170º C

Taconic Advanced Dielectric Division manufactures PTFE/woven glass base materials for microwave, RF and high speed digital applications. Applications include LNAs, LNBs, PCS/PCN antennas, GSM and UMTS antennas, power amplifiers, filters, passive components, automotive cruise control, aerospace guidance telemetry, phase array radar, etc.



PrePreg Material
It announced TerraGreen, a halogen-free, ultra-low loss, RF/microwave/high-speed material. TerraGreen is engineered for such high-performance applications as power amplifier boards for 4G LTE base stations.

Benefits:

  • Taconic

    PTFE and fiberglass fabric are the base materials for almost everything Taconic produces. The benefits of PTFE coatings are proven:

    · Temperature and chemical resistance

    · High dielectric strength

    · Dimensional stability under heat and pressure

    · Low electrical losses

    · Low-friction/non-stick smooth surface

  • RF-35TC High TC, DK 3.5 base material

  • CER-10 High DK Material, easily fabricated

  • TRF-41, TRF-43,TRF-45 Low cost RF laminate with FR4 DK values

  • TSM family of materials provides a solution to the difficulty of manufacturing high layer count multilayer PCBs with PTFE cores. The low fiberglass content of the TSM family allows more predictable multilayer manufacturing vs. non-woven materials.

Typical Applications:

  • Microwave & RF Laminates
    Applications: automotive, LED, mechanical, medical, military, multilayer, RF/microwave, thin core packaging & flexible interconnect

    Applications: aerospace, apparel, automotive, carpet/flooring, chemical processing, composites, food processing, lamination, packaging, paper, plastics, PVC welding, rubber processing, screen printing and textile

Production Description :

Parameter Value
Specific gravity/density 1.850 g/cm3 (3,118 lb/cu yd)
Water absorption −0.125 in < 0.10%
Temperature index 140 °C (284 °F)
Thermal conductivity, through-plane 0.29 W/(m·K),[1] 0.343 W/(m·K)[2]
Thermal conductivity, in-plane 0.81 W/(m·K),[1] 1.059 W/(m·K)[2]
Rockwell hardness 110 M scale
Bond strength > 1,000 kg (2,200 lb)
Flexural strength (A; 0.125 in) - LW > 440 MPa (64,000 psi)
Flexural strength (A; 0.125 in) - CW > 345 MPa (50,000 psi)
Tensile strength (0.125 in) LW > 310 MPa (45,000 psi)
Izod impact strength - LW > 54 J/m (10 ft·lb/in)
Izod impact strength - CW > 44 J/m (8 ft·lb/in)
Compressive strength - flatwise > 415 MPa (60,200 psi)
Dielectric breakdown (A) > 50 kV
Dielectric breakdown (D48/50) > 50 kV
Dielectric strength 20 MV/m
Relative permittivity (A) 4.8
Relative permittivity (D24/23) 4.8
Dissipation factor (A) 0.017
Dissipation factor (D24/23) 0.018
Dielectric constant permittivity 4.70 max., 4.35 @ 500 MHz, 4.34 @ 1 GHz
Glass transition temperature Can vary, but is over 120 °C
Young's modulus - LW 3.5×106 psi (24 GPa)
Young's modulus - CW 3.0×106 psi (21 GPa)
Coefficient of thermal expansion - x-axis 1.4×10−5 K−1
Coefficient of thermal expansion - y-axis 1.2×10−5 K−1
Coefficient of thermal expansion - z-axis 7.0×10−5 K−1
Poisson's ratio - LW 0.136
Poisson's ratio - CW 0.118
LW sound speed 3602 m/s
SW sound speed 3369 m/s



Competitive Advantage:
1) With UL,ROHS,ISO,IPC
2).Lead time:3-10 working days
3)Competitive price best quality
4).Rich 20 years experience in High Tg Multilayer PCB .


What Information customer need to provide for quotation ?
1. PCB Gerber files ,protel,powerpcb,Autocad,etc.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

Detailed Images :











Multilayer High Frequency Taconic Pcb TLY Military Low DK Base

Multilayer High Frequency Taconic Pcb TLY Military Low DK Base


























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Multilayer High Frequency Taconic Pcb TLY Military Low DK Base

















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