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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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FR4 Quick Turn 2 Layer PCB HASL Lead Free For Consumer Electronics

Shenzhen Xinchenger Electronic Co.,Ltd
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Shenzhen Xinchenger Electronic Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Tel: 86-755-26055813
Contact Person:
Ms kico

FR4 Quick Turn 2 Layer PCB HASL Lead Free For Consumer Electronics

Brand Name : XCE
Model Number : XCEF
Certification : CE,FCC,Rohs,ISO9001,SGS,UL
Place of Origin : China
MOQ : 1PCS
Price : USD 1-500
Payment Terms : Western Union, L/C, T/T
Supply Ability : 10000000pcs / per month
Packaging Details : inner vacuum package, outer carton box
Board size : 6*4cm
Board THK : 1.2mm
Cu THK : 0.5OZ
Material : FR4
Application : Consumer electronics
Layer : 2
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FR4 Quick Turn 2 Layer PCB HASL Lead Free For Consumer Electronics​


Application:


Consumer electronics

Automobile

Backplanes

Servers and Networking

Telecommunications

Data Storage

Heavy Copper Application


Specification:


Base Material: FR4
Layer:2
Thickness: 1.2MM
Copper weight:0.5OZ
Surface finish: HASL Lead free

Key Features


Advanced High Tg Resin Technology

Industrial standard material with high Tg (175℃ by DSC) multifunctional epoxy resin and excellent thermal reliability.

Lead-Free Assembly Compatible

RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃.

Friendly Processing and CAF Resistance

Friendly PCB process like high Tg FR4. Users can short the learning curve when using this material.


CAF Resistance

Low thermal expansion coefficient (CTE) helps to excellent thermal reliability and CAF resistance providing long-term reliability for industrial boards and automobile application.


Available in Variety of Constructions

Available in a various of constructions, copper weights and glass styles, including standard(HTE), RTF and VLP copper foil.


Parameter:


Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm



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