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Shenzhen Xinchenger Electronic Co.,Ltd
Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Fr4 High Frequency PCB Circuit Green For Wireless Communication Field

Shenzhen Xinchenger Electronic Co.,Ltd
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Shenzhen Xinchenger Electronic Co.,Ltd
City: Shenzhen
Province/State: Guangdong
Country/Region: China
Contact Person:Ms karen

Fr4 High Frequency PCB Circuit Green For Wireless Communication Field

Brand Name : XCE
Model Number : XCEF
Certification : CE,FCC,Rohs,ISO9001,SGS,UL
Place of Origin : China
MOQ : 1PCS
Price : USD 1-500
Payment Terms : Western Union, L/C, T/T
Supply Ability : 10000000pcs / per month
Packaging Details : inner vacuum package, outer carton box
Color : Green
Layer : 2
Board size : 6*5cm
Board THK : 1.2mm
Cu THK : 35UM
Panel Size : 3*2
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Fr4 High Frequency PCB Circuit Green For Wireless Communication Field​


Features:

>Glass-reinforced hydrocarbon and ceramic dielectric

>Excellent high frequency performance due to low dielectric tolerance and loss

>Stable electrical properties versus frequency

>Low Z-axis expansion and excellent dimensional stability


Specification:


Base Material: Fr4 high frequency
Layer:2
Thickness: 1.2MM
Copper weight:1OZ
Surface finish: Immersion gold

Since the day of company foundation we continuously enaged in researching special and high precision printed circuit boards with the strong production capability of 2 to 28 layers of highly precise impedence,multi-layer blind buried,multi-layer mix-compression,highTG, copper substrate,Ceramic substrate PCB.we emphasize the significance of traning program for every single staff in the company even grass-roots employees which becomes the most competitive factors to excel from others,our company have many experienced and professional teams from management to production line,30% are highly educated among the total amount of employees,advanced engineers and senior technicians are up to 80 people.

With advanced foreign technology supports and domestic 3G/4G device manufacturer in microwave pcb field which lead our experienced hi-frequencey researching team to one step ahead of the line of printed circuit board business,we are hornored to obtain sound reputations over our wolrdwide customers on the basis of fine qulity,prompt delivery,satisfied after sales service for may years and we assure our customers that we will return the favors with more and more superior products in the near future.


Applications:

High frequency high frequency wireless communication

High speed computer

Satellite signal transmission equipment

Microstrip and cellular base station

Antennas and power amplifiers

LNA/LNB


Parameter:


Layer No.1-16
Min board thickness2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness  >0.025mm(1mil)
Finished hole0.2mm-6.3mm
Min line width4mil/4mil(0.1/0.1mm)
Min bonding pad space0.1mm(4mil)
PTH aperture tolerance±0.075mm(3mil)
NPTH aperture tolerance±0.05mm(2mil)
Hole site deviation±0.05mm(2mil)
Profile tolerance±0.10mm(4mil)
Board bend&warp≤0.7%
Insulation resistance>1012Ωnormal
Through-hole resistance<300Ωnormal
Electric strength>1.3kv/mm
Current breakdown10A
Peel strength1.4N/mm
Soldmask regidity>6H
Thermal stress288℃20Sec
Testing voltage50-300v
Min buried blind via0.2mm(8mil)
Outer cooper thickness1oz-5oz
Inner cooper thickness1/2 oz-4oz
Aspect ratio8:1
SMT min green oil width0.08mm
Min green oil open window0.05mm
Insulation layer thickness0.075mm-5mm
Aperture0.2mm-0.6mm

Product Tags:

pcb manufacturing process

      

Custom Printed Circuit Board

      
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